Abstract

In this paper we developed flip-chip bonder using XY stage, liner-rotary actuator and vision system. We depicted the major parts of the developed flip-chip bonder. Then we discussed several problems and their solutions such as vision and motion control, pick-up module position accuracy, separation of chip from the blue taped hoop, etc. We used a post guide to improve the horizontal positional accuracy against the long arm. Also, we used an ejector module and synchronization technique for easy chip separation from the blue tape.

Keywords

• flip-chip;
• Pixel;
• pattern matching;
• resolution;
• normality

• 표면에 전기적인 연결이 직접 되는 칩;
• 영상의 화소;
• 영상 정합;
• 해상도;
• 정규성;