Abstract

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

Keywords

• Bondability;
• Thick film;
• Electronics Device;
• Parallel Gap Rsistance Bonding;
• Pulse Heat Tip Bonding;
• Fluxless Bonding;
• Alumina substrate

• 접합성;
• 후막;
• 알루미나기판;
• 전자부품;
• 패러렐 갭 저항 접합법;
• 펄스 가열 팁 접합;
• 비용가제 접합;