Preparation and dielectric properties of polyimide thin films by vapor deposition polymerization method

진공증착중합에 의한 Polyimide 박막의 제조와 유전특성

  • 이덕출 (인하대 공대 전기공학과) ;
  • 김형권 (인하대 대학원 전기공학과)
  • Published : 1996.03.01

Abstract

Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c $m_{-1}$. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.

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