The Journal of Korean Institute of Communications and Information Sciences (한국통신학회논문지)

The Korean Institute of Commucations and Information Sciences (한국통신학회)
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SPICE models of PCB traces in high-speed systems

고속 시스템에서의 PCB 선로의 SPICE 모델

  • Published : 1997.01.01
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Abstract

Physical interconnect such as Printed Circuit Board(PCB) traces introduces new challenges for parameter extraction and delay calculation for high-speed system design. PCB traces are dominated by frequency dependent LC propagation which makes precharacterization difficult for all possible configurations. Moreover, simulating the transient behavior of the trace for noise and delay analysis requries the combined used of a variety of models and techniques for efficiently handling lossy, low-loss, frequency dependent, and coupled transmission lines together with lumped elements. In this paper we explain how the frequency dependence caused by ground plane proximity and skin effects can be modeled using the adstracted models. These abstracted (lumped) models are SPICE-compatible and can be simulated in time-domain, along with precharacterized lumped parasitic elements and nonlinear driver and load models.

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References

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