Abstract

The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.

Keywords

• Heat pipe;
• Thermosyphon;
• Working fluid;
• Non-condensable gas;
• Wick;
• Electronic packaging technology

• 히트파이프;
• 써모사이폰;
• 작동유체;
• 불응축 가스;
• 심지;
• 실장기술;