Abstract

This paper presents a visual inspection algorithm looking for solder joint defects of IC chips on PCBs (Printed Circuit Boards). In this algorithm, seven features are proposed in order to categorize the solder joints into four classes such as normal, insufficient, excess, and no solder, and optimal back-propagation network is determined by error evaluation which depend on the number of neurons in hidden and out-put layers and selection of the features. In the end, a good accuracy of classification performance, an optimal determination of network structure and the effectiveness of chosen seven features are examined by experiment using proposed inspection algorithm.

Keywords

• Visual Inspection System;
• Neural Network;
• Solder Joint Inspection;
• Back-Propagation

• 시각 검사 시스템;
• 신경 회로망;
• 납땜 검사;
• 역전파;