Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
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Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies : I, Effects of Binder Burnout Process on the Formation of Electrode Line

고주파용 저온 동시소성 세라믹(LTCC)칩 커플러 제조: I. 전극형성에 대한 결합제 분해공정의 영향

  • 조남태 (한양대학교 세라믹공정연구센터) ;
  • 심광보 (한양대학교 세라믹공정 연구센터) ;
  • 이선우 (한양대학교 세라믹소재 연구소) ;
  • 구기덕 ((주)케이세라)
  • Published : 1999.06.01
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Abstract

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

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References

  1. J. Am. Ceram. Soc. v.74 no.5 Ceramic and Glass-Ceramic Packaging in the 1990s R. R. Tummala
  2. ISHM 91 Proceedings Low Temperature Co-fired Ceramic:An Emerging Technology in Europe M. Massiot
  3. ISHM 92 Proceedings Application of Low Temperature Fired Multilayered Substrates to High Frequency M. Kato;S. Nishigaki
  4. IMC 1996 Proceeding Advanced Ceramic Multilayer functional Paekages for Telecommunications Equipment H. Mandai;N.Nakajima and K. Tongegawa
  5. ISHM 94 Proceedings Structure-Property Relationships in Low-Temperature Cofired Ceramic A.A.Shapiro;D.F.Elwell
  6. ISHM 94 Proceedings Multifunctional Ceramic Substrates and Packages for Telecommunication Applications C. Makihara;K. Ikeda;H. Wada;Y. Sawa;S. Tanahashi
  7. IMC 94 Proceedings Study of the Strain Mechanism of Multilayer Ceramic Substrate M.Totokawa;J. Ishikawa;A. Kobayashi
  8. ISHM 92 Proceedings Real Time Sintering Observations of LTCC Substrate and Conductor Materials W. S. Hackenberger;T.R. Shrout;J P. Dougherty;R.F. Speyer
  9. ISHM 93 Proceedings Sintering Phenomena and Microstructural Development in LTCC Multilayer Substrates W.S. Hackenberger;T.R. Shrout;J.P. Dougherty