Abstract

In CMP for semiconductor wafer films, the acceptable within-chip planarity, within-wafer and wafer-to-wafer nonuniformity could be achieved by conditioning. The role of conditioning is to remove continuously polishing residues from pad and to maintain the initial pad surface pores. To reach these requirements, the diamond grits disk has been considered as a conventional conditioner. However, we have investigated many defects as scratch on wafers out of diamond grits shedding, contaminations from bonding materials, and pad pore subsidences by over-conditioning. So, this paper studies the effect of ultrasonic vibration in CMP conditioning as a representative. The effect of ultrasonic vibration was certified through ILD, Metal CMP.

Keywords

• CMP;
• Pad;
• Slurry;
• Conditioner;
• Ultrasonic Vibration

• 화학기계적연마;
• 연마포;
• 연마액;
• 컨디셔너;
• 초음파진동;