Reverse Engineering of Compound Surfaces Using Boundary Detection Method

  • Cho, Myeong-Woo (Department of Mechanical Engineering, Inha University) ;
  • Seo, Tae-Il (Research Institute for Mechanical Engineering, Inha University) ;
  • Kim, Jae-Doc (Department of Mechanical Engineering, Inha University) ;
  • Kwon, Oh-Yang (Department of Mechanical Engineering, Inha University)
  • Published : 2000.10.01

Abstract

This paper proposes an efficient reverse engineering technique for compound surfaces using a boundary detection method. This approach consists in extracting geometric edge information using a vision system, which can be used in order to drastically reduce geometric errors in the vicinity of compound surface boundaries. Through the image-processing technique and the interpolation process, boundaries are reconstructed by either analytic curves (e. g. circle, ellipse, line) or parametric curves (B-spline curve). In other regions, except boundaries, geometric data are acquired on CMM as points inspected using a touch type probe, and then they are interpolated on several surfaces using a B-spline skinning method. Finally, the boundary edge and the skinned surfaces are combined to reconstruct the final compound surface. Through simulations and experimental works, the effectiveness of the proposed method is confirmed.

Keywords

References

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