Analysis of Woven Wire Wick Structure for a Miniature Heat Pipe

소형 히트파이프용 편조 윅의 형상 해석

  • Published : 2001.01.01

Abstract

Woven wire wick is very effective structure because of its easiness to insert inside of pipe for a miniature heat pipe. The present study was conducted to investigate the effect of the effective flow passage with respect to wire helix angle. Also effective thermal conductivity were examined by defining mean porosity considering effective liquid flow passages. Effective heat transfer area is varied with respect to wire helix angle, and in the range of $\thet=60~65^{\circ}C$, heat transfer area is decreased about 15~20%. Permeability of woven wire wick shows similar value of 200 mesh screen wick. And comparison of experimental results on effective thermal conductivity shows a fairly good agreement with the analytical results.

Keywords

References

  1. Proceedings of the 11th International Heat Pipe Conference Effect of mesh shape on maximum capillary pressure of plain weave screen Noda, H.;Kumagai, M.
  2. Proceedings of the 11th International Heat Pipe Conference The design and testing of an improved wick structure to be used in heat pipes for electronic cooling application Sauciuc, I.;Mochizuki, M.;Mashiko, K.;Saito, Y.;Nguyen, T.
  3. Proceedings of the 11th International Heat Pipe Conference Manufacturing procedure and porous structure characterization of tubular wicks Bazzo, E.;Reimbrecht, E. G.;Fernandes, C. P.
  4. Proceedings of the 11th International Heat Pipe Conference A flexible heat pipe with carbon fiber arterial wick Akihiro, S.
  5. Proceedings of the 11th International Heat Pipe Conference Improved heat pipe performance using graded wick structures Zuo, Z. J.;North, M. T.
  6. Heat Pipe Science and Technology Faghri, A.
  7. Heat Pipe Theory and practice Chi, S. W.
  8. Heat Pipes(4th edition) Dunn, P. D.;Reay, D. A.
  9. Proceedings of the 11th International Heat Pipe Conference Cooling characteristics of miniature heat pipes with woven-wired wick Kim, K. S.;Moon, S. H.;Choi, C. G.