Heat Transfer Characteristics of the U-shape Heat Pipe using Working Fluid of PFC

PFC 작동유체 사용 U형 히트파이프의 열전달특성 연구

  • 이기우 (한국에너지기술연구원 페열이용연구센터) ;
  • 박기호 (한국에너지기술연구원 페열이용연구센터) ;
  • 전원표 (한국에너지기술연구원 페열이용연구센터)
  • Published : 2001.08.01

Abstract

The purpose of the present study is to examine the heat transfer characteristics of the U-shape heat pipe for the cooling of semiconductor in subway train. Perflouro-carbon(PFC) was used as working fluid. Temperature distribution on the surface and heat transfer coefficients were investigated according to the working fluid volume percent and heating rate. The results were as follows; Optimum volumetric percent of working fluid was from 80% to 90%, and hat transfer coefficients of evaporation and condensation were as follows, respectively. $\hbar_ie=0.37\times(\frac{P_i}{P_O})$l_c}^0.3$,$\hbar_ic-4.2(\frac{\kappa_l^3p_l^2gh_fg}{\mu_lq_c_l_c}^\frac{1}{3}

Keywords

References

  1. AIAA Paper No. 72-269 Application of Heat Pipes to Electronic Equipment Cooling Feldmanils, C. J.
  2. Proceedings of the SAREK 1997 Winter Annual Conference A Study on Heat Transfer Performances of a Heat Pipe Cooling Device for Power Control Semiconductors Kang, H. K.;Kim, C. J.;Kim, J. J.;Lee, J. T.;Yim, K. B.
  3. Heat Pipe Technology Cooling of Converter Element for Scota Electric Car Kyr, L;Horvath, L.
  4. Transaction of the JAR v.5 no.2 Heat Transfer in a Two-Phase Closed-Loop Thermosyphon Experimental Investigation of Heat Transfer in an Evaporator and a Condenser Imura, H.;Saito, Y.
  5. Practical Heat Pipe Daily Industrial News Paper Co.
  6. Int. J. Heat Mass Transfer v.26 no.8 Critical Heat Flux in a Closed Two-phase Thermosyphon Imura, H.;Sasaguchi, K.;Kozai, H.
  7. Heat Pipes Dunn,P.D.;Reay,D.A.
  8. Proceedings of the SAREK 1999 Winter Annual Conference A Study on Heat Transfer Characteristics of U Heat Pipe by Working Fluid PFC Lee,K.W.;Chun,W.P.;Park,K.H.;Lee,K.J.;Kim,S.S.
  9. Report of KIER A Development on Heat Pipe Heat Sink for Cooling the Semiconductor of Subway Train Lee, K. W.;Kim, S. S. (et al.)