Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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The Effect of Base Metal Grain Boundary on Isothermal Solidification Phenomena during TLP Bonding of Ni Base Superalloys

액상확산접합한 Ni기 초내열합금의 등온응고거동에 미치는 모재결정입계의 영향

  • 김대업 (현대모비스(주) 기술연구소)
  • Published : 2001.06.01
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Abstract

The effect of base metal grain size on isothermal solidification behavior of Ni-base superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding of single crystal. coarse-grained and fine-grained CMSX-2 was carried out at 1373∼1548k for various holding time in vacuum. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process for single crystal, coarse-grained and fine-grained base metals. The completion time for isothermal solidification decreased in the order ; single crystal, coarse-grained and fine-grained base metals. The difference of isothermal solidification rates produced when bonding the different base metals could be explained quantitatively by the effect of base metal grain boundaries on the apparent average diffusion coefficient of boron in CMSX-2.

Keywords

References

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