Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Thermo-mechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry

무아레 간섭계를 이용한 WB-PBGA 패키지의 온도변화 및 굽힘하중에 대한 거동해석

  • Published : 2002.07.01
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Abstract

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

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References

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