Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Electroless Ni-P layer Characteristics in accordance with the plating process conditions

무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화

  • Published : 2003.06.01
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Abstract

Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

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