Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)

The Korean Society of Mechanical Engineers (대한기계학회)
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New Design Approach for the Uniform Temperature of Precision Hot Plates

초정밀 가열판의 온도 균질화를 위한 새로운 설계방법

  • 박용환 (호서대학교 환경안전공학부)
  • Published : 2003.11.01
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Abstract

In the precision hot plate for wafer processing, uniform temperature of the upper plate is one of key factors affecting the quality of wafers. The state-of-the-art precision hot plates require temperature Variations less than $\pm$0.4$^{\circ}C$ during heating to 15$0^{\circ}C$, Which is difficult to be obtained only by the improvement of manufacturing techniques alone. In this study, computer aided heat transfer analysis was carried out to obtain the temperature distribution of the currently used reference hot plate for 200mm wafer. The analysis on the reference model assuming constant heat generation rate and uniform heating area showed total variation of 0.926$^{\circ}C$ at 15$0^{\circ}C$. One of the new design approaches based on the change of heating location together with different heat generation rate resulted in total variation of 0.297$^{\circ}C$ which is a 68% improvement compared to that of the reference model.

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References

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