DOI QR코드

DOI QR Code

Fluid Flow and Temperature Distribution Around a Surface-Mounted Module Cooled by Forced Air Flow in a Portable Personal Computers

휴대용 컴퓨터 내에 실장된 강제공랭 모듈 주위의 유체유동과 온도분포

  • 박상희 (금오공과대학교 기계공학부) ;
  • 신대종 (알티전자(주) 기술연구소)
  • Published : 2004.02.01

Abstract

This paper reports an experimental study around a module about forced air flow by blower (35${\times}$35${\times}$6㎣) in a portable personal computer model(200${\times}$235${\times}$10㎣). Experimental report is to know three data to investigate thermal resistance, adiabatic wall temperature and visualized fluid flow around the module by combination of the moving number and the arrangement method of blower. The channel inlet flow velocity has been varied between 0.26, 0.52 and 0.78㎧, and input power ( $Q_{p}$) to the module is 4W. To investigate thermal resistance. the heated module is mounted on two boards(110${\times}$110${\times}$1.2㎣, k=20.73, 0.494W/ $m^{\circ}C$) in parallel-plate channel to forced air flow. The temperature distribution were visualized by heated module on acrylic board(k=0.262W/ $m^{\circ}C$) using liquid crystal film. Fluid flow around the module were visualized using particle image velocimetry system.

Keywords

References

  1. Chang, M. J., Shyu, R. J. and Fang, L. J., 1987, 'An Experimental Study of Heat Transfer from Surface Mounted Components to a Channel Airflow,' ASME Paper No. 97-HT-75
  2. Roeller, P. T., Stevens, J., and Webb, B. W., 1991, 'Heat Transfer and Turbulent Flow Characteristics of Isolated Three-Dimensional Protrusions in Channels,' ASME J. of Heat Transfer, Vol. 113, pp. 597-603 https://doi.org/10.1115/1.2910607
  3. Rosten, H. I., and Viswanath, R., 1994, 'Thermal Modeling of the Pentium TM Processor Package,' IEEE Electronic Component Technology Conf., Washington, D.C., pp. 421-428
  4. Behnia, M., Nakayama, W. and Wang, J., 1998, 'CFD Simulation of Heat Transfer from a Heated Module in an Air Streams Comporison with Experiments and a Parametric Study,' InterSociety Conf. on Thermal Phenomena, pp. 43-151 https://doi.org/10.1109/ITHERM.1998.689532
  5. Nakamura, H., Igarashi, T. and Tsutsui, T., 2001, 'Local Heat Transfer Around Wall-Mounted Cube in the Turbulent Boundary Layer,' Int. J. of Heat and Mass Transfer, Vol. 44, pp. 3385-3395 https://doi.org/10.1016/S0017-9310(01)00009-6
  6. Park, S. H. and Shin, D. J., 2002, 'A Study on the Heat Transfer Characteristics Around a Surface-Mounted Air-Cooled Module for the Flow Angle-of-Attack,' Trans. of the KSME, B, Vol. 26, No. 9, pp. 1267-1275 https://doi.org/10.3795/KSME-B.2002.26.9.1267
  7. Graham, K. and Witzman, S., 1988, 'Analytical Correlation of Thermal Design of Electronic Packages,' Cooling Technology for Electronic Equipment, pp. 249-264
  8. Nakayama, W. and Park, S. H., 1996, 'Conjugate Heat Transfer from a Single Surface-Mounted Block to Forced Convective Air Flow in a Channel,' ASME J. of Heat Transfer, Vol. 118, pp. 301-309 https://doi.org/10.1115/1.2825845
  9. Lee, J. H., Park, S. H., Riu, K. J. and Bang, C. H., 2000, 'Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel,' Trans. of the KSME, B, Vol. 24-15, pp. 632-639
  10. Park, S. H. and Hong, T., 2002, 'Ehancement of Heat Transfer from an Air-Cooled 3-Dimen-sional Module by Means of Heat Spreading in the Board,' Trans. of the KSME, B, Vol. 26, No. 7, pp. 1022-1030
  11. Zhang, X., Imamura, T. and Fujii M., 1999, 'Conjugate Heat Transfer from Small Heat Source Mounted on a Conductive Wall,' ASME Advances in Electronic Packaging, EEP-Vol. 26-1, pp. 511-519
  12. Kobayashi, T., Ogushi, T., Sumi, N. and Fujii, M., 1998, 'Thermal Design of a Ultra-Slim Notebook Computer,' in InterSociety Conference on Thermal Phenomena, pp. 15-21 https://doi.org/10.1109/ITHERM.1998.689513
  13. Hisano, K., Iwasaki, H. and Ishizuka, M., 1996, 'Thermal Analysis of Compact Electronic Equip-ment,' in Proceedings of the 6th International Symposium on Transport Phenomena and Dynamics of Rotating Machinery, Vol. 2
  14. Viswanath, R. and Ali, I. A., 1997, 'Thermal Modeling of High Performance Package in Portable Computers,' in IEEE Trans. on Componets, Packaging and Manufacturing Technology. Part A, Vol. 20, No. 2 https://doi.org/10.1109/95.588579
  15. Kline, S. J. and McClintock, F. A., 1953, 'Describing Uncertainties in Single-Sample Experiments,' Mechamical Engineering, Jan, pp. 3-8