Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Soldering Process of Au Bump using Longitudinal Ultrasonic

종방향 초음파를 이용한 Au 범프의 솔더링 공정

  • 김정호 (한국과학기술원 기계공학과) ;
  • 이지혜 (한국과학기술원 기계공학과) ;
  • 유중돈 (한국과학기술원 기계공학과) ;
  • 최두선 (한국기계연구원 지능형 정밀기계연구부)
  • Published : 2004.02.01
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Abstract

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

Keywords

References

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