The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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Implementation of High-Quality Si Integrated Passive Devices using Thick Oxidation/Cu-BCB Process and Their RF Performance

실리콘 산화후막 공정과 Cu-BCB 공정을 이용한 고성능 수동 집적회로의 구현과 성능 측정

  • Published : 2004.05.01
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Abstract

High-performance Si integrated passive process was developed using thick oxidation process and Cu-BCB process. This passive process leads to low-cost and high-quality RF module with a small form factor. The fabricated spiral inductor with 225 um inner diameter and 2.5 turns showed the inductance of 2.7 nH and the quality factor more than 30 in the frequency region of 1 ㎓ and above. Also WLCSP-type integrated passive devices were fabricated using the high-performance spiral inductors. The fabricated low pass filter had a parallel-resonance circuit inside the spiral inductor to suppress 2nd harmonics and showed about 0.5 ㏈ insertion loss at 2.45 ㎓. And also the high/low-pass balun had the insertion loss less than 0.5 ㏈ and the phase difference of 182 degrees at 2.45 ㎓.

Cu 및 BCB 공정을 사용하여 고성능 RF 수동회로를 실리콘 기판 상에 구현하는 RF 수동 집적회로 공정을 개발하였다. 이러한 기술은 개별 수동소자를 통한 모듈 구현방식보다 훨씬 작고 저렴하며 우수한 성능의 RF모듈을 구현할 수 있게 하였다. 개발된 실리콘 수동 집적회로 공정으로 제작된 내경 225 um, 회전수 2.5의 인덕터는 2.7 nH의 인덕턴스를 가지며 1 ㎓ 이상에서 30 이상의 품질계수를 가지는 것으로 측정되었다. 또한 개발된 인덕터를 사용하여 WLCSP(Wafer Level Chip Scale Package) 형태의 수동회로를 제작하였다. 제작된 저역 여파기는 2차 고조파 억제를 위해 인덕터 내경 안에 병렬공진용 커패시터를 삽입하였고 2.45 ㎓에서 0.5 ㏈ 이하의 삽입손실을 보였다. 그리고 고역 여파기와 저역 여파기 구조를 가지는 발룬 회로는 2.45 ㎓에서 0.5 ㏈ 이하의 삽입손실과 182도의 출력 단자간 위상 차이를 보여주었다.

Keywords

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