Study on the manufacturing of high-frequency heating Japanese cedar laminated board by finger jointing method (1) - Gluing characteristics of Japnese cedar board by PVAc emulsion adhesives -

핑거접합방식에 의한 삼나무의 고주파가열 집성판 제조에 관한 연구 (1) - 삼나무 판재의 초산비닐수지 접착특성 -

  • So Won-Tek (Insti. of Ag. Sci. and Tech., Dept. of Forest Products and Technology, Chonnam Nat'l Univ.) ;
  • Chai Jyung-Ki (Insti. of Ag. Sci. and Tech., Dept. of Forestry, Chonnam Nat'l Univ.)
  • 소원택 (전남대학교 임산공학과, 농업과학기술연구소) ;
  • 채정기 (전남대학교 임학과, 농업과학기술연구소)
  • Published : 2005.04.01

Abstract

This experiment was carried out to investigate the gluing characteristics of poly vinyl acetate emulsion adhesive(PVAc) on the Cryptomeria japonica laminated boards. This sample trees are major planting species and have been planted in southern district for a long time. The optimum gluing conditions for laminated board were summarized as follows; the amount of spreading glue, assembly time, clamping pressure, and clamping time for PVAc resin were $200g/m^2$, 10min., $5kg/cm^2$, and 6hrs., respectively, and the relative formulae between extension ratio(x) and block shear strength(y) was $y=-9.6x+85.2(R^2=0.95)$.

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