Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Preparation of Ceria Coated Silica Abrasive by Hydrothermal Treatment and Polishing Rate on Oxide Film

수열처리에 의한 세리아가 코팅된 실리카 연마재의 제조 및 Oxide Film의 연마특성

  • Ryu Dae Sun (Composite Materials Center, Korea Institute of Ceramic Eng. & Tech.,) ;
  • Kim Dae Sung (Composite Materials Center, Korea Institute of Ceramic Eng. & Tech.,) ;
  • Lee Seung-Ho (Composite Materials Center, Korea Institute of Ceramic Eng. & Tech.,)
  • 유대선 (요업기술원 복합재료센터) ;
  • 김대성 (요업기술원 복합재료센터) ;
  • 이승호 (요업기술원 복합재료센터)
  • Published : 2005.12.01
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Abstract

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH $2\~10$ than ceria coated silica slurries without its modification.

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References

  1. H. Nojo, M. Kodera and R. Nakata, IEEE, 96, 349 (1996)
  2. T. Hoshino, Y. Kurata, Y. Terasaki and K. Susa, J. NonCryst. Solids, 283, 129 (2001) https://doi.org/10.1016/S0022-3093(01)00364-7
  3. L. M. Cook, J. Non-Cryst. Solids, 120, 152 (1990) https://doi.org/10.1016/0022-3093(90)90200-6
  4. R. Brands, T. Konthe, F. Klaessig, F. Menzel, W. Lortz and G. Varga, CMP-MIC Conference, 73-76 (2003)
  5. S.-H. Lee, Z. Lu, S. V Babu and E. Metijevic , J. Mater. Res., 17, 2744 (2002) https://doi.org/10.1557/JMR.2002.0396
  6. S. Lakhwani and M. N. Rahaman, J. Mater. Res., 14, 1455-61 (1999) https://doi.org/10.1557/JMR.1999.0196
  7. M. Hirano, Y. Fukuda, H. Iwata, Y. Hotta and M. Inagaki, J. Am. Ceram. Soc., 83(5), 1287-89 (1993) https://doi.org/10.1111/j.1151-2916.2000.tb01371.x
  8. M. Hirano and E. Kato, J. Am. Ceram. Soc., 79, 777-80 (1996) https://doi.org/10.1111/j.1151-2916.1996.tb07943.x
  9. Pei-Lin Chen and I-Wei Chen, J. Am. Ceram. Soc., 76(5), 1577-83 (1993) https://doi.org/10.1111/j.1151-2916.1993.tb03942.x
  10. W. P. Hsu, L. Ronnquist and E. Metijevic , Langmuir, 4, 31 (1988) https://doi.org/10.1021/la00079a005
  11. J. M. Steigerwald, S.P. Murarka and R.J. Gutman, 'Chemical Mechanical Planarization of Microelectronic Materials', John Wiely & Sons, p 40 (1997)
  12. P.-J. Ko, S.-W. Park, N.-H. Kim, Y.-J. Seo and W.-S. Lee, J. Korea Institute of Electrical and Electronic Mater. Eng., 18, 219 (2005) https://doi.org/10.4313/JKEM.2005.18.3.219
  13. Z. Lu, S.-H. Lee, V R. K. Gorantla, S. V Babu and E. Metijevic , J. Mater. Res., 18, 2323 (2003) https://doi.org/10.1557/JMR.2003.0326
  14. K. Hanawa, N. Mochizuki and N. Ueda, U.S. Patent 5938837 (1999)
  15. R. K. Iler, 'The chemistry of silica,' John Wiely & Sons, p 48 (1979)
  16. K. Goto, J. Chem. Soc. Jap. Pure Chem. Sect., 76, 1364 (1955)