Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
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Development of Nanofluidic Thermosyphon Heat Sink

나노유체를 이용한 열사이폰 히트싱크

  • Rhi Seok-Ho (School of Mechanical Engineering, Chungbuk National University) ;
  • Shin Dong-Ryun (School of Mechanical Engineering, Mongil University) ;
  • Lim Taek-Kyu (School of Mechanical Engineering, Chungbuk National University) ;
  • Lee Chung-Gu (School of Mechanical Engineering, Chungbuk National University) ;
  • Park Gi-Ho (Korea Institute of Energy Research, Building Energy Research Center) ;
  • Lee Wook-Hyun (Korea Institute of Energy Research, Building Energy Research Center)
  • 이석호 (충북대학교 공과대학 기계공학부) ;
  • 신동륜 (명지대학교 기계공학부) ;
  • 임택규 (충북대학교 공과대학 기계공학부) ;
  • 이충구 (충북대학교 공과대학 기계공학부) ;
  • 박기호 (한국에너지 기술연구원 폐열이용연구센터) ;
  • 이욱현 (한국에너지 기술연구원 폐열이용연구센터)
  • Published : 2006.10.01
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Abstract

A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

Keywords

References

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