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Optimum deposition conditions of AlN thin film on the Si substrate for SAW application

SAW 소자 응용을 위한 실리콘 기판 위에 AlN 박막의 최적 증착 조건에 관한 연구

  • 고봉철 (현대자동차) ;
  • 남창우 (울산대학교 전기전자정보시스템공학부)
  • Published : 2007.07.31

Abstract

AlN thin film for SAW filter application was deposited on (100) silicon wafers by reactive magnetron sputtering method. The structural characteristics were dependent on the deposition conditions such as sputtering pressure, RF power, substrate temperature, and nitrogen partial pressure. Scanning Electron Microscope (SEM), X-ray Diffraction (XRD), Electron Probe MicroAnalyzer (EPMA) and Atomic Force Microscope (AFM) have been used to find out structural properties and preferred orientation of AlN thin films. Insertion loss of SAW devices was 28.51 dB and out of band rejection was about 24 dB.

Keywords

References

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