Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
권호 표지

Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element method

경계요소법을 이용한 반도체 패키지의 응력특이성 해석

  • Published : 2007.12.15
Download PDF
⟨ Previous Next ⟩

Abstract

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

Keywords

References

  1. Ju, Y., Saka, M. and Abe, H., 2001, 'Detection of Delamination in IC Packages Using the Phase of Microwaves,' International Journal of NDT & E, Vol. 34, pp. 49-56 https://doi.org/10.1016/S0963-8695(00)00044-X
  2. Miura, H., Nishimura, A., Kawai, S. and Nishi, K., 1998, 'Residual Stress in Resin-Molded IC Chips,' Transaction of the JSME, Vol. 55, No. 516, pp. 1763-1770
  3. Miura, H., Nishimura, A., Kawai, S. and Murakami, G., 1990, 'Effect of Package Structures on the Residual Stress of Silicon Chips Encapsulated in IC Plastic Packages,' Transaction of the JSME, Vol. 56, No. 522, pp. 175-181 https://doi.org/10.1299/kikaib.56.175
  4. Sato, M., Ruuki, R., Yoshoka, S. and Inoue, A., 1994, 'Analysest of Delamination Arrest Effect of Dimples on Interface in LSI Package,' Transaction of the JSME, Vol. 60, No. 577, pp. 1985-1991
  5. Lee, K. Y., Moon, H. S., Lee, T. S. and Kim, K. S., 1995, 'Plastic IC Package Cracking Analysis due to Thermal Stress,' Transaction of the KSME, Vol. 19, No. 12, pp. 3197-3204
  6. Lee, K. Y. and Yang, J. H., 1998, 'Viscoelastic Cracking Analysis of Plastic IC Package with Polyimide Coating Layer,' Transaction of the KSME, Vol. 22, No. 10, pp. 1930-1937
  7. Park, S. S., Pahn, L. O. and Earmme, Y. Y., 1994, 'A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(2),' Transaction of the KSME, Vol. 18, No. 8, pp. 2158-2166
  8. Alpen, P. and Lee, K. C., 2000, 'A Simple Model for the Mode I Popcorn Effect for IC Packages,' Microelectronics Reliability, Vol. 40, pp. 1503-1508 https://doi.org/10.1016/S0026-2714(00)00116-5
  9. Ju, Y., Saka, M. and Abe, H., 2001, 'Nondestructive Inspection of Delamination in IC Package by High-frequency Microwaves,' International Journal of NDT & E, Vol. 34, pp. 213-217 https://doi.org/10.1016/S0963-8695(00)00059-1
  10. Chung, N. Y. and Oh, B. T., 1996, 'Evaluation Method of Bonded Strength Considering Stress Singularity in Adhesively Bonded Joints,' Transaction of the KSME, Vol. 20, No. 7, pp. 2087-2096
  11. Chung, N. Y. and Park, C. H., 2005, 'Analysis of Stress Singularities on Interfaces of Friction Welded Dissimilar Materials,' Transaction of the KSAE, Vol. 13, No. 2, pp. 142-148
  12. Chung, N. Y. and Park, C. H., 2005, 'Analysis of Residual Stress Singularities on Interfaces of Friction Welded SUH35/SUH3,' Transaction of the KSAE, Vol. 13, No. 5, pp. 104-111
  13. Bogy, D. B., 1975, 'The Plane Solution for Joined Dissimilar Elastic Semistrips under Tensions,' J. Appl. Mech, Vol. 42, pp. 93-98 https://doi.org/10.1115/1.3423560
  14. Chung, N. Y. and Song, C. H., 1996, “Prediction of Propagation Path for the Interface Crack in Bonded Dissimilar Materials,” Transaction of the KSAE, Vol. 4, No. 3, pp. 111-121
  15. Chung, N. Y. and Park, C. H., 2007, 'An Evaluation Method of Fracture Toughness on Interface Crack in Friction Welded Dissimilar Materials,' Transaction of the KSAE, Vol. 15, No. 4, pp. 171-177