DOI QR코드

DOI QR Code

Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement

전기적 및 전기화학적 특성 측정을 이용한 전자제품 신뢰성평가

  • 홍원식 (전자부품연구원 신뢰성평가센터) ;
  • 오철민 (전자부품연구원 신뢰성평가센터) ;
  • 박노창 (전자부품연구원 신뢰성평가센터) ;
  • 송병석 (전자부품연구원 신뢰성평가센터) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
  • Published : 2007.04.30

Abstract

Keywords

References

  1. W. Engelmaier, and A. I. Attarwala : Surface Mount Attachment Reliability of Clip-Leaded Ceramic Chip Carriers on FR-4 Circuit Boards, IEEE Transaction CHMT, 12-2 (1989), 284-296
  2. JEDEC Solid State Technology Association : JESD22-A104 Rev.B, Temperature cycling, JC-14.1 Committee on Reliability Test methods for Packaged Devices JEDEC, Arlington, VA (2000)
  3. D. A. Jones : Principles and Prevention of Corrosion, p.74, Macmillan Pub. Company, New York (1992)
  4. W. S. Hong and K. B. Kim : Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder, Korean Journal of Materials Research, 15-8 (2005), 536-542 (in Korean)
  5. W. S. Hong, W. S. Kim, S. H. Park and K. B. Kim : Polarization Behaviors of SnCu Pb-Free Solder Depending on the P, Ni, Addition, Korean Journal of Materials Research, 15-8 (2005), 528-535 (in Korean)
  6. W. S. Hong, S. B. Jung and K. B. Kim : Analysis Method of Metallic Ion Migration, Journal of KWS, 23-2 (2005), 138-146 (in Korean)
  7. J. E. Sohn : IPC-TR-476A Electrochemical Migration: Electrically Induced Failure in Printed Wiring Assemblies, Electrical Migration Task Group of IPC, IL (1997)
  8. Y. Aoki, H. Tanaka, S. Yamamoto and O. Obata : Evaluation Method for Ion Migration Using Dew Cycle Test(Part 1), Espec Tech. Report, 1 (1996), 16-22
  9. Y. Aoki, H. Tanaka, S. Yamamoto and O. Obata : Evaluation Method for Ion Migration Using Dew Cycle Test(Part 2), Espec Tech. Report, 1 (1996), 23-27
  10. J. H. Lau, and Y. H. Pao : Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill, New York (1997)
  11. R. Ghaffarian, and W. Engelmaier et al, The Institute for Interconnecting and Packaging Electronic Circuit : IPC 9701 Performance Test Methods and QuaIification Requirements for Surface Mount Solder Attachments, the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product and Reliability Committee (6-10) of IPC, Northbrook IL (2002)