DOI QR코드

DOI QR Code

Method of Particle Contamination Control for Yield Enhancement in the Cleanroom

클린룸 제조공정에서 수율개선을 위한 입자오염제어 방법

  • 노광철 (서울시립대학교 산업기술연구소) ;
  • 이현철 (삼성전기 생산기술연구소 MCC TG) ;
  • 김대영 (삼성전기 생산기술연구소 MCC TG) ;
  • 오명도 (서울시립대학교 기계정보공학과)
  • Published : 2007.06.01

Abstract

The practical studies on the method of particle contamination control for yield enhancement in the cleanroom were carried out. The method of the contamination control was proposed, which are composed of data collection, data analysis, improvement action, verification, and implement control. The partition check method and the composition analysis for data collection and data analysis were respectively used in the main board and the cellular phone module production lines. And these methods were evaluated by the variation of yield loss between before and after improvement action. In case that the partition check method was applied, the critical process step was selected and yield loss reduction through improvement actions was observed. While in case that the composition analysis was applied, the critical sources were selected and yield loss reduction through improvement actions was also investigated. From these results, it is concluded that the partition check and the composition analysis are effective solutions for particle contamination control in the cleanroom production lines.

Keywords

References

  1. Cho, S. J., 2006, 'VOCs Contamination Control in the Cleanroom,' The 6th Advanced Course for Cleanroom Technology, Korea Air Cleaning Association, pp. 245-264
  2. Oh, M. D., 2002, 'A Trend of GIGA Level Cleanroom Technology,' International Symposium on Clean Technology and Management for Indoor Air, Korea Air Cleaning Association, pp. 17-62
  3. Whyte, W., 2001, Cleanroom Technology - Fundamentals of Design, Testing, and Operation, Johnson Wiley & Sons, England
  4. Mori, K., Nam, N., Keeten, D., Burns, R., 1994, 'Yield Enhancement with Particle Defects Reduction,' Proceedings of IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems, IEEE, pp. 246-253 https://doi.org/10.1109/DFTVS.1994.630036
  5. Zhou, C., Ross, R., Vickery, C., Metteer, B., Gross, S., Verret, D., 2002, 'Yield Prediction Using Critical Area Analysis with Inline Defect Data,' 2002 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, IEEE, pp. 82-86 https://doi.org/10.1109/ASMC.2002.1001579
  6. Tsunoda, Y., Kanamitsu, K., Iwata, Y., Matsumoto, C., Kamoda, K., Hamamura, Y., Kojika, F., 2005, 'Integrated Yield Management System using Critical Area Analysis,' Proceedings of IEEE International Symposium on Semiconductor Manufacturing, IEEE, pp. 233-236 https://doi.org/10.1109/ISSM.2005.1513344
  7. Kwon, Y. J., Walker, D. M. H., 1995, 'Contamination Control using Production Test Data,' Proceedings of IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEEE, pp. 70-76 https://doi.org/10.1109/IEMT.1995.526095
  8. Wei, B. C., 1991, 'A Unified Approach to Failure Mode, Effects and Criticality Analysis (FMECA),' Proceedings of the Annual Reliability and Maintainability Symposium, IEEE, pp. 260-271 https://doi.org/10.1109/ARMS.1991.154445
  9. Kennedy, M., 1998, 'Failure Modes and Effects Analysis of Flip Chip Devices Attached to Printed Wiring Boards (PWB),' Proceedings of IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEEE, pp. 232-239 https://doi.org/10.1109/IEMT.1998.731080
  10. Papadopoulos, Y., Parker, D., Grante, C., 2004, 'Automating the Failure Modes and Effects Analysis of Safety Critical Systems,' Proceedings of the 8th IEEE International Symposium on High Assurance Systems Engineering, IEEE, pp. 310-311 https://doi.org/10.1109/HASE.2004.1281774
  11. Guldi, R. L., 2004, 'In-Line Defect Inspection From a Historical Perspective and Its Implications for Future Integrated Circuit Manufacturing,' IEEE Transactions on Semiconductor Manufacturing, IEEE, Vol. 17, No. 4, pp. 629-640 https://doi.org/10.1109/TSM.2004.835717
  12. Abuzeid, S., 1995, 'Total Contamination Control: The Minienvironment Era,' Proceedings of IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEEE, pp. 269-276 https://doi.org/10.1109/IEMT.1995.526125
  13. Tokunaga, N., Okamura, S., Sasaki, S., Nakamura, S., Mieno, F., 1995, 'Particle Count and Analysis by using a Cyclone Particle Count,' Proceedings of IEEE International Symposium on Semiconductor Manufacturing, IEEE, pp. 175-177 https://doi.org/10.1109/ISSM.1995.524384
  14. Lee, K., H., 2006, 'Cleanroom Contamination Control in the Semiconductor Device Manufacturing Process,' The 1st Semiconductor/LCD Contamination Control Workshop, Korean Society for Indoor Environment, pp. 81-122

Cited by

  1. CFD Based Shape Design of Guide Vane for Fan Filter Unit vol.37, pp.7, 2013, https://doi.org/10.3795/KSME-B.2013.37.7.709