Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4 Plasma Treatment

CF4플라즈마 처리에 의한 잉크젯 프린팅 Ag박막과 폴리이미드 사이의 계면파괴에너지 향상에 관한 연구

  • Park, Sung-Cheol (School of Material Science and Engineering, Andong National University) ;
  • Cho, Su-Hwan (Central R&D Institute, Samsung Electro-mechanics) ;
  • Jung, Hyun-Cheol (Central R&D Institute, Samsung Electro-mechanics) ;
  • Joung, Jae-Woo (Central R&D Institute, Samsung Electro-mechanics) ;
  • Park, Young-Bae (School of Material Science and Engineering, Andong National University)
  • Published : 2007.04.27
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Abstract

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

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