Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Improvement of Pot Life in the Epoxy Resin-based Adhesive Formulation by Size Control and Coating of Curing Accelerator Powders

경화촉매 분말의 입도조절 및 표면코팅에 의한 에폭시 레진 기반 혼합조성의 상온 보관특성 개선

  • Lee, Jun-Sik (Micro-Joining Center/Advanced Joining Technology Team, KITECH (Korea Institute of Industrial Technology)) ;
  • Hyun, Chang-Yong (Department of Materials Science and Engineering, Seoul National University of Technology) ;
  • Lee, Jong-Hyun (Department of Materials Science and Engineering, Seoul National University of Technology)
  • 이준식 (한국생산기술연구원 정밀접합팀/마이크로조이닝센터) ;
  • 현창용 (서울산업대학교 신소재공학과) ;
  • 이종현 (서울산업대학교 신소재공학과)
  • Published : 2008.04.28
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Abstract

To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.

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References

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