Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish

OSP와 ENIG 표면처리에 따른 BGA 패키지의 무연솔더 접합부 피로수명

  • Oh, Chulmin (Physics of Failure Research Center, Korea Electronic Technology Institute) ;
  • Park, Nochang (Physics of Failure Research Center, Korea Electronic Technology Institute) ;
  • Hong, Wonsik (Physics of Failure Research Center, Korea Electronic Technology Institute)
  • 오철민 (전자부품연구원 고장물리연구센터) ;
  • 박노창 (전자부품연구원 고장물리연구센터) ;
  • 홍원식 (전자부품연구원 고장물리연구센터)
  • Received : 2007.11.06
  • Published : 2008.02.10
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Abstract

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

Keywords

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