Journal of the Korean Physical Society

Korean Physical Society (한국물리학회)
권호 표지
DOI QR코드

DOI QR Code

Insertion of a $TiO_2$ Buffer Layer for the Fixation of Electrospun $TiO_2$ Nanofibers on Glass Substrates

  • Lee, Deuk-Yong (Department of Materials Engineering, Daelim University College) ;
  • Cho, Jung-Eun (Department of Materials Engineering, Daelim University College) ;
  • Lee, Myung-Hyun (Green Ceramics Division, Korea Institute of Ceramic and Engineering) ;
  • Cho, Nam-Ihn (Department of Electronic Engineering, Sun Moon University) ;
  • Song, Yo-Seung (Department of Materials Engineering, Korea Aerospace University)
  • Published : 20090700
⟨ Previous Next ⟩

Abstract

Titania nanofibers were fabricated by drying electrospun $TiO_2$/polyvinylpyrrolidone nanofibers for 5 h in air and subsequent annealing for 3 h at temperatures from 450 $^{\circ}C$ to 550 $^{\circ}C$ in air. To improve the bond strength, a $TiO_2$buffer layer with a thickness of 400 nm was spin-coated onto the glass slide prior to electrospinning by using the same precursor solution. Only the anatase $TiO_2$ phase was observed for the $TiO_2$/PVP fibers calcined at temperatures between 450 and 550 $^{\circ}C$, but the fibers calcined at temperatures higher than 600 $^{\circ}C$ yielded a mixture of anatase and rutile phases. The bond strength of the $TiO_2$ nanofibers with a height of 1 ${\mu}m$ was investigated by using a tape test according to ASTM D 3359-02 to evaluate the extent of adhesion of the fiber mat to the glass substrate. Among the coatings, the highest bond strength of the fibers was achieved for the $TiO_2$ nanofiber/$TiO_2$ buffer layer/glass coatings calcined at 500 $^{\circ}C$. Experimental results revealed that the extent of adherence increased by 10% when the buffer layer was inserted between the fibers and the glass. Therefore, it can be concluded that the addition of a buffer layer has a modest influence on the bond strength between the nanofiber mat and the glass substrate.

Keywords

Acknowledgement

This work was supported by grant no. RTI04-01-02 from the Regional Technology Innovation Program of the Ministry of Knowledge Economy (MKE), Republic of Korea. Special thanks, as well, to Mr. J. Eric Lee at Northwestern University for his help during the manuscript preparation.

References

  1. Z. L. Wang, Materials Today, 26 (2004)
  2. D. Li and Y. Xia, Nano Lett. 3, 555 (2003) https://doi.org/10.1021/nl034039o
  3. S. Lee, N. I. Cho and D. Y. Lee, J. European Ceram. Soc. 27, 3651 (2007) https://doi.org/10.1016/j.jeurceramsoc.2007.02.010
  4. D. Y. Lee, B. Kim, S. Lee, M. Lee, Y. Song and J. Lee, J. Korean Phys. Soc. 48, 1686 (2006)
  5. T. V. Chuong, L. Q. T. Dung and D. Q. Khieu, J. Korean Phys. Soc. 52, 1526 (2008) https://doi.org/10.3938/jkps.52.1526
  6. S. Kim, Y. Choi, Y. Song, D. Y. Lee and S. Lee, Mater. Lett. 57, 343 (2002) https://doi.org/10.1016/S0167-577X(02)00788-7
  7. H. Choi, S. Kim, Y. Song and D. Y. Lee, J. Mater. Sci. 39, 5695 (2004) https://doi.org/10.1023/B:JMSC.0000040078.09843.cb
  8. Y. Song, S. Kim, B. Kim and D. Y. Lee, Mater. Sci. Forum. 449-452, 1261 (2004) https://doi.org/10.4028/www.scientific.net/MSF.449-452.1261
  9. Y. Kim, D. Y. Lee, M. Lee, N. Cho, S. Lee and Y. Song, J. Korean Phys. Soc. 53, 421 (2008) https://doi.org/10.3938/jkps.53.421
  10. M. M. Hohman, M. Shin, G. Rutledge and M. P. Brenner, Phys. Fluids. 13, 2201 (2001) https://doi.org/10.1063/1.1383791
  11. M. M. Hohman, M. Shin, G. Rutledge and M. P. Brenner, Phys. Fluids. 13, 2221 (2001) https://doi.org/10.1063/1.1384013
  12. M. Anand, H. Shim, Y. Kim, W. Kim and H. Kim, J. Korean Phys. Soc. 53, 2423 (2008) https://doi.org/10.3938/jkps.53.2423
  13. Y. H. Hyun, S. Y. Park, Y. P. Lee, M. K. Shin and S. J. Kim, J. Korean Phys. Soc. 53, 1690 (2008) https://doi.org/10.3938/jkps.53.1690
  14. S. Lee, K. Ye, Y. Song and D. Y. Lee, J. Mater. Sci. Lett. 22, 315 (2003) https://doi.org/10.1023/A:1022324901461
  15. ASTM Designation D 3359-02, Standard Test Methods for Measuring Adhesion by Tape Test, ASTM International, West Conshohocken, PA, U.S.A., 2002
  16. M. Zheng, M. Gu, Y. Jin, H. Wang, P. Zu, P. Tao and J. He, Mater. Sci. Eng. B 87, 197 (2001) https://doi.org/10.1016/S0921-5107(01)00743-7
  17. E. A. Barringer and H. K. Bown, Langmuir 1, 414 (1985) https://doi.org/10.1021/la00064a005