Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Analyses of Fracture Parameters and Prediction of Crack Propagation Path on Delamination in the LSI Package

반도체 패키지의 층간박리 파괴역학인자 해석 및 균열진전경로 예측

  • Published : 2009.08.15
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Abstract

This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

Keywords

References

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