Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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A Study on Design of High Luminance Hybrid LED Package and Ultra-fine Machining of Optical Pattern

고효율 Hybrid LED 패키지 설계 및 초정밀 광학패턴 가공에 관한 연구

  • 전은채 (한국기계연구원 나노공정장비연구실) ;
  • 제태진 (한국기계연구원 나노공정장비연구실) ;
  • 황경현 (한국기계연구원 나노공정장비연구실)
  • Received : 2010.09.29
  • Accepted : 2010.10.19
  • Published : 2010.12.01
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Abstract

Newly suggested hybrid LED package can reduce the number of LED processes and enhance light efficacy in virtue of its integrated optical patterns. Square-type pyramid pattern was chosen for the integrated optical pattern in this study, and it was proved that the pattern enhances illuminance about three times and luminance about two and half times by optical simulation. Square-type pyramid patterns of 0.02mm height and 0.04mm pitch were successively machined on a copper mold which is necessary for imprinting the integrated pattern. Hybrid LED package with integrated optical pattern will be manufactured with ultra-fine machined mold in future study.

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References

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