Journal of the Korean Institute of Illuminating and Electrical Installation Engineers (조명전기설비학회논문지)

The Korean Institute of IIIuminating and Electrical Installation Engineers (한국조명전기설비학회)
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Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB

FR4 PCB의 Via-hole이 LED 패키지에 미치는 열적 특성 분석

  • 이세일 (원광대학교 공대 정보통신과) ;
  • 이승민 (금호전기(주)기술연구소) ;
  • 박대희 (원광대학교 전기전자 및 정보공학부)
  • Received : 2010.11.15
  • Accepted : 2010.12.09
  • Published : 2010.12.31
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Abstract

The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.

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References

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