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Multi-scale wireless sensor node for health monitoring of civil infrastructure and mechanical systems

  • Taylor, Stuart G. (The Engineering Institute, Los Alamos National Laboratory) ;
  • Farinholt, Kevin M. (The Engineering Institute, Los Alamos National Laboratory) ;
  • Park, Gyuhae (The Engineering Institute, Los Alamos National Laboratory) ;
  • Todd, Michael D. (Department of Structural Engineering, University of California) ;
  • Farrar, Charles R. (The Engineering Institute, Los Alamos National Laboratory)
  • Received : 2009.10.14
  • Accepted : 2010.02.20
  • Published : 2010.07.25

Abstract

This paper presents recent developments in an extremely compact, wireless impedance sensor node (the WID3, $\underline{W}$ireless $\underline{I}$mpedance $\underline{D}$evice) for use in high-frequency impedance-based structural health monitoring (SHM), sensor diagnostics and validation, and low-frequency (< ~1 kHz) vibration data acquisition. The WID3 is equipped with an impedance chip that can resolve measurements up to 100 kHz, a frequency range ideal for many SHM applications. An integrated set of multiplexers allows the end user to monitor seven piezoelectric sensors from a single sensor node. The WID3 combines on-board processing using a microcontroller, data storage using flash memory, wireless communications capabilities, and a series of internal and external triggering options into a single package to realize a truly comprehensive, self-contained wireless active-sensor node for SHM applications. Furthermore, we recently extended the capability of this device by implementing low-frequency analog-to-digital and digital-to-analog converters so that the same device can measure structural vibration data. The compact sensor node collects relatively low-frequency acceleration measurements to estimate natural frequencies and operational deflection shapes, as well as relatively high-frequency impedance measurements to detect structural damage. Experimental results with application to SHM, sensor diagnostics and low-frequency vibration data acquisition are presented.

Keywords

References

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