Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
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Cooling Performance of Thermoelectric Module with Air-Cooled Heat Exchanger Fins

공랭식 열교환핀이 부착된 열전모듈의 냉각 성능에 관한 연구

  • Shin, Jae-Hoon (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
  • Han, Hun-Sik (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Yun-Ho (Division of Mechanical Engineering, Hanyang University) ;
  • Kim, Seo-Young (Energy Mechanics Research Center, Korea Institute of Science and Technology) ;
  • Hyun, Jae-Min (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology)
  • 신재훈 (한국과학기술원 기계공학과) ;
  • 한훈식 (한국과학기술원 기계공학과) ;
  • 김윤호 (서울시립대학교 기계정보공학과) ;
  • 김서영 (한국과학기술연구원) ;
  • 현재민 (한국과학기술원 기계공학과)
  • Published : 2010.03.10
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Abstract

Thermal performance of louver fin and plate fin in a thermoelectric cooling system with a duct-flow type fan arrangement is analytically evaluated. The thermoelectric cooling system consists of a thermoelectric module and two heat exchanger fins. The analytic results show that the optimized louver fin has lower thermal resistance than plate fin. The COP and heat absorbed rate of the thermoelectric cooling system with optimized louver fins are 10.3% and 5.8% higher than optimized plate fins, respectively.

Keywords

References

  1. Lineykin, S. and Ben-Taakov, S., 2007, Modeling and analysis of thermoelectric modules, IEEE Transactions on Industry Application, Vol. 43, No. 2, pp. 505-512. https://doi.org/10.1109/TIA.2006.889813
  2. Lineykin, S. and Ben-Taakov, S., 2007, Userfriendly and intuitive graphical approach to the design of the thermoelectric cooling systems, Int. J. Refrigeration, Vol. 30, pp. 798-804. https://doi.org/10.1016/j.ijrefrig.2006.12.004
  3. Saini, M. and Webb, R. L., 2002, Heat rejection limits of air cooled plate fin heat sinks for computer cooling, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 71-79.
  4. Kim, S. Y. and Webb, R. L., 2006, Analysis of convective thermal resistance in ducted fanheat sinks, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp. 439-448. https://doi.org/10.1109/TCAPT.2006.880522
  5. Kays, W. M. and London, A. L., 1984, Compact Heat Exchangers, New York, McGraw-Hill.
  6. Dong, J., Chen, J., Chen, Z., Zhang, W. and Zhou, Y., 2007, Heat transfer and pressure drop correlations for the multi-louvered fin compact heat exchangers, Energy Conversion and Management, Vol. 48, pp. 1506-1515. https://doi.org/10.1016/j.enconman.2006.11.023
  7. Shah, R. K. and Sekulic, D. P., 2003, Fundamentals of Heat Exchanger Design, New York, Wiley.
  8. Webb, R. L., 1994, Principles of Enhanced Heat Transfer, New York, Wiley.
  9. Astrain, D., Vian, J. G. and Dominguez, M., 2003, Increase of COP in the thermoelectric refrigeration by optimization of heat dissipation, Applied Thermal Engineering, Vol. 23, pp. 2183-2200. https://doi.org/10.1016/S1359-4311(03)00202-3