Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Printing Process Combining Screen Printing with Reverse Off-set for a Fine Patterning of Electrodes on Large Area Substrate

스크린 인쇄와 리버스 오프셋 인쇄를 혼합한 대면적 미세 전극용 인쇄공정

  • Park, Ji-Eun (Department of Electronics Engineering, Dong-A University) ;
  • Song, Chung-Kun (Department of Electronics Engineering, Dong-A University)
  • Received : 2011.12.15
  • Accepted : 2011.01.09
  • Published : 2011.05.11
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Abstract

In this paper a printing process for patterning electrodes on large area substrate was developed by combining screen printing with reverse off-set printing. Ag ink was uniformly coated by screen printing. And then etching resist (ER) was patterned in the Ag film by reverse off-set printing, and then the non-desired Ag film was etched off by etchant. Finally, the ER was stripped-off to obtain the final Ag patterns. We extracted the suitable conditions of reverse Using the process we successfully fabricated gate electrodes and scan bus lines of OTFT-backplane used for e-paper, in which the diagonal size was 6 inch, the resolution $320{\times}240$, the minimum line width 30 um, and sheet resistance 1 ${\Omega}/{\Box}$.

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