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A Study on the Holding of LED Sapphire Substrate Using Alumina Electrostatic Chuck with Fine Electrode Pattern

미세 전극 패턴을 갖는 알루미나 정전척을 이용한 LED용 사파이어 기판 흡착 연구

  • Kim, Hyung-Ju (Department of Advanced Materials Engineering, Kyonggi University) ;
  • Shin, Yong-Gun (Department of Advanced Materials Engineering, Kyonggi University) ;
  • Ahn, Ho-Kap (Aegisco Co. Ltd.) ;
  • Kim, Dong-Won (Department of Advanced Materials Engineering, Kyonggi University)
  • Received : 2011.08.19
  • Accepted : 2011.08.30
  • Published : 2011.08.31

Abstract

In this work, handling of sapphire substrate for LED by using an electrostatic chuck was studied. The electrostatic chuck consisted of alumina dielectric, which was doped with 1.2 wt% $TiO_2$. As the volume resistivity of alumina dielectric was decreased, the electrostatic force was increased by Johnsen-Rahbek effect. The narrower width and gap size of electrode led to the stronger electrostatic force. When alumina dielectric with $3.20{\times}10^{11}{\Omega}{\cdot}cm$ resistivity and 3 mm width/1.5 mm gap sized electrode was used, the strongest electrostatic force in this work was obtained, which value reached to ~14.46 gf/$cm^2$ at 2.5 kV for 4-inch sapphire substrate. This results show that alumina electrostatic chuck with low resistivity and fine electrode pattern is suitable for handling of sapphire substrate for LED.

Keywords

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