Journal of the Korean Solar Energy Society (한국태양에너지학회 논문집)

The Korean Solar Energy Society (한국태양에너지학회)
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Laser via drilling technology for the EWT solar cell

EWT 태양전지 제작을 위한 레이저 미세 관통홀 가공 기술

  • 이홍구 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 서세영 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 현덕환 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 이용화 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 김강일 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 정우원 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 이아름 (한화케미칼 중앙연구소 솔라연구센터) ;
  • 조재억 (한화케미칼 중앙연구소 솔라연구센터)
  • Received : 2011.06.28
  • Accepted : 2011.08.18
  • Published : 2011.08.30
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Abstract

Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.

Keywords

References

  1. James M. Gee, et al, Emitter wrap-through solar cells, IEEE, 1993
  2. Peter Fath, Grid Parity Factory-Centrotherm photovoltaics AG, Dutch Solar Energy R&D Seminar 2009
  3. Mohamed M. Hilali, et al, Two-dimensional modeling of EWT multicrystalline silicon solar cells and comparison with the IBC solar cell, IEEE, 2006
  4. Nils-Peter Harder et al, Laser-processed high-efficiency silicon RISE-EWT solar cells and characterization, Phys. Status Solidi C 6, No. 3, 736-43 (2009) https://doi.org/10.1002/pssc.200880720
  5. James M. Gee, et al, Development of industrial high efficiency back contact czochralski-silicon solar cells, Prog. Photovolt: Res. Appl., 2011
  6. H. Haverkamp, et al, Screen printed EWT cells: Limitations and alternative approaches to the manufacturing process, 23rd EC PVSEC, 2008
  7. Junsin Yi, Commercial Technology Development of Solar Cells and Grid Connected 3kW PV System for PV House Supply, 2005
  8. Engelhart P. et al, Laser processing for back-contacted silicon solar cells, Proceedings ICALEO, paper M703, 2006
  9. Alexander Polyakov, Timon Grob, et al, Comparison of Via-Fabrication Techniques for Through-Wafer Electrical Interconnect Applications, 2004 Electronic Components and Technology Conference
  10. D.V. Tran and A.G. Aberle, Overview on the use of laser processing techniques for high efficiency silicon wafer solar cells, Proc. 18th International Photovoltaic Science and Engineering Conference, Kolkata, Jan 2009
  11. Finlay Colville, THE HOLE STORY: Lasers Take the Wrap, INTER PV, 2009
  12. A. Schoonerdbeek et al, Laser technology for costreduction in silicon solar cell production, Proc. Of 69th Laser Materials Processing Conference, ISBN 4-947684-70-4, 2007.
  13. Yun Zhoua, et al, Physical mechanism of silicon ablation with long nanosecond laser pulses at 1064nm through time-resolved observation, Applied Surface Science 257 (2011) 2886-2890 https://doi.org/10.1016/j.apsusc.2010.10.086
  14. Henrikki Pantsar, et al, Laser microvia drilling and ablation of silicon using 355 nm pico and nanosecond pulses, ICALEO 2008 Congress Proceedings, 2008
  15. T. Baier, et al, Theoretical approach to estimate laser process parameters for drilling in crystalline silicon, Prog. Photovolt: Res. Appl., 2010
  16. R. Kling, The interaction of laser light with crystalline Silicon, Optec Networkshop photovoltaics, 2007
  17. Mingirulli N, et al. Life time studies on laser drilled vias for application in emitter-wrap-through solar cells. In Proceedings of the 22nd European Photovoltaic Solar Energy Conference, Milan, Italy, 2007
  18. Knorz, et al, High speed laser drilling: Parameter evaluation and characterization, 5th World Conferenceon Photovoltaic Energy Conversion, 6-10, September 2010
  19. MingirulliN,etal.Passivationoflaser-drilled viaholesforemitter-wrap-through-cells. In Proceedings ofthe 23rd European PhotovoltaicSolarEnergy Conference, Valencia, Spain, 2008; 996-999
  20. Mingirulli N, et al. Resistance analysis of wrapped-through emitters. In Proceedings of the 33rd IEEE Photovoltaic Specialists Conference, SanDiego, USA, 2008; 116-119.
  21. C. Ulzhofer, et al, VIRE effect: via-resistance-induced recombination enhancement- The origin of reduced fill factors of emitter wrap through solar cells, 24th European Photovoltaic Solar Energy Conference, 2009
  22. Christian Ulzhofer, et al, Loss analysis of emitter-wrap-through silicon solar cells by means of experiment and three-dimensional device modeling, JOURNAL OF APPLIED PHYSICS 107, 104509, 2010 https://doi.org/10.1063/1.3373612
  23. E. Schneiderlochner, et al, Scanning Nd:YAG laser system for industrially applicable processing in silicon solar cell manufacturing, Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conferenceon, 2003
  24. Richard Hendel, Lasers in Thin-Film and c-Si Photovoltaics, Solar NovusToday, 06 September 2010
  25. Richard Hendel, Laser Applications in Solar Cell Manufacturing-LasersPlay a Significant Role in the Development of New Production Processesin Photovoltaics, LTJ (Lser Technik Journal) Volume 5, Issue 1, pages 32-35, January 2008
  26. 3D-Micromac AG, Heavy Duty Laser Machining of EWT Solar Cells (2008, 3D-Micromac AG, Press Release)
  27. Reinhart Poprawe M.A., High speed drilling for modern cell concepts, Fraunhofer Institute for Laser Technology ILT, 04/2009
  28. http://www.isfh.de/institut_solarforschung/photovoltaik.php?_1=1

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