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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Novel Bumping Material for Solder-on-Pad Technology

  • Choi, Kwang-Seong (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Chu, Sun-Woo (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Lee, Jong-Jin (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Sung, Ki-Jun (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Bae, Hyun-Cheol (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Lim, Byeong-Ok (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Moon, Jong-Tae (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Eom, Yong-Sung (Convergence Components & Materials Research Laboratory, ETRI)
  • Received : 2010.08.04
  • Accepted : 2010.11.02
  • Published : 2011.08.30
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Abstract

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

Keywords

References

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