Journal of the Korean Institute of Illuminating and Electrical Installation Engineers (조명전기설비학회논문지)

The Korean Institute of IIIuminating and Electrical Installation Engineers (한국조명전기설비학회)
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Effect of the Epoxy Mold on the Thermal Dissipation Behavior of LED Package

LED 패키지에서 에폭시 몰드가 방열특성에 미치는 영향

  • 방영태 (호서대학교 대학원) ;
  • 문철희 (호서대학교 디지털디스플레이공학과)
  • Received : 2011.11.11
  • Accepted : 2012.01.19
  • Published : 2012.02.29
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Abstract

LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[$^{\circ}C$] when the mold height was 3~5[mm], but the thermal conductivity of the mold didn't affect the junction temperature significantly.

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References

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