Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effect of Alkali Surface Modification on Adhesion Strength between Electroless-Plated Cu and Polyimide Films

알카리 표면개질 처리가 무전해 구리 도금피막과 폴리이미드 필름의 접합력에 미치는 효과

  • Son, Lee-Seul (Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology) ;
  • Lee, Ho-Nyun (Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology) ;
  • Lee, Hong-Kee (Heat Treatment & Plating Technology Center, Incheon Regional Division, Korea Institute of Industrial Technology)
  • 손이슬 (한국생산기술연구원 인천지역본부 열표면기술센터) ;
  • 이호년 (한국생산기술연구원 인천지역본부 열표면기술센터) ;
  • 이홍기 (한국생산기술연구원 인천지역본부 열표면기술센터)
  • Received : 2012.01.20
  • Accepted : 2012.02.28
  • Published : 2012.02.29
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Abstract

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

Keywords

References

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