Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)

The Korean Society of Mechanical Engineers (대한기계학회)
권호 표지
DOI QR코드

DOI QR Code

Observation of Size Effect and Measurement of Mechanical Properties of Ti Thin Film by Bulge Test

벌지 실험을 통한 Ti 박막의 크기 효과 관찰 및 기계적 물성 측정

  • Received : 2012.05.29
  • Accepted : 2012.10.09
  • Published : 2013.01.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this study, the mechanical properties of a Ti thin film are measured by a bulge test. In the bulge test, uniform pressure is applied to one side of the film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties of the film. Ti thin films with thicknesses of 1.0, 1.5, and $2.0{\mu}m$ were deposited on a Si wafer by using an RF magnetron sputtering system. These specimens were annealed at $600^{\circ}C$ for 150, 300, and 600 s to investigate the effect of temperature on the yield stress and mechanical properties of the Ti films. The elastic modulus, residual stress, and yield stress of these membranes are measured by a bulge test. The experimental results suggest that the yield stress is sensitive to the film thickness and annealing time.

본 연구에서는 벌지 실험을 이용하여 티타늄 박막의 기계적 물성을 측정하였다. 벌지 실험은 외적 지지구조를 가지지 않는 박막 시편의 한 면에 일정한 압력을 가하여 박막의 변위를 측정, 압력과 변위의 관계를 이용하여 박막의 기계적 물성을 측정하는 실험이다. 스퍼터링을 이용해 증착된 티타늄 박막의 두께는 1.0, 1.5, $2.0{\mu}m$ 이고, 물성의 열처리 시간에 대한 영향을 알아보기 위해 증착된 시편은 $600^{\circ}C$에서 각각 150, 300, 600 초 동안 열처리 되었다. 박막의 탄성 계수, 잔류 응력, 항복 응력이 벌지 실험을 통해 측정되었고, 실험 결과 항복 응력은 열처리 시간에 의존하는 특성을 확인하였다. 또한 시편 두께가 감소할수록 강도가 증가하는 크기효과를 관찰하였다.

Keywords

References

  1. Ding, J. N. and Meng, Y.G., 2000, "Specimen Size Effect on Mechanical Properties of Polysilicon Microcantilever Beams Measured by Deflection Using a Nanoindenter," Mater. Sci. Eng., B83, pp. 42-47
  2. Fleck, N. A., Muller, G. M., Ashby, M. F. and Hutchinson, J. W., 1994, "Strain Gradient Plasticity : Theory and Experiment," Acta Metal. Mater., Vol. 42, No.2, pp. 475-487 https://doi.org/10.1016/0956-7151(94)90502-9
  3. Stölken, J. S. and Evans, A. G., 1998, "A Microbend Test Method for Measuring the Plasticity Length Scale," Acta Materialia, Vol. 46, No. 14, pp. 5190-5115
  4. Connolley, T., Mchugh, P. E. and Bruzzi, M., 2005, "A Review of Deformation and Fatigue of Metals at Small Size Scales," Fatigue Fract. Engng. Mater. Struct., Vol. 28, pp.1119-1152 https://doi.org/10.1111/j.1460-2695.2005.00951.x
  5. Beams, J. W., 1959, in Structure and Properties of Thin Films of Gold and Silver, New York, John Wiley and Sons, pp. 183
  6. Martha, K.S. and Nix, W.D., 1992, "Analysis of the Accuracy of the Bulge Test in Determining theMechanical Properties of Thin Films," Journal of Materials Research, Vol. 7, No. 6, pp. 1553-1563 https://doi.org/10.1557/JMR.1992.1553
  7. Vlassak, J.J. and Nix, W. D., 1992, "A New Bulge Test Technique for the Determination of Young's Modulus and Poisson's Ratio of Thin Film," Journal of Materials Research, Vol. 7, No. 12, pp. 3242-3249 https://doi.org/10.1557/JMR.1992.3242
  8. Nicola, L., Xiang, Y., Vlassak, J.J., Van Der Giessen, E. and Needleman, A., 2006, "Plastic Deformation of Freestanding Thin Film: Experiments and Modeling," J. Mech. Phys. Solids, Vol. 54, pp.2089-2110 https://doi.org/10.1016/j.jmps.2006.04.005
  9. Dieter, M.S., Maibach, J. and Obermeier, E., 1995, "A New Analytical Solution for the Load - Deflection of Square Membranes," Journal of Microelectromechanical systems, Vol. 4, No. 4, pp. 238-241 https://doi.org/10.1109/84.475551
  10. Bonnotte, E., Delobelle, P. and Bornier, L., 1997, "Two Interferometeric Methods for the Mechanical Characterization of Thin Films by Bulging Tests. Application to Silicon Single Crystal," Journal of Materials Research, Vol. 12, No. 9, pp. 2234-2248 https://doi.org/10.1557/JMR.1997.0299
  11. Tabata, O., Kawahata, K., Sugiyama, S. and Igarashi, I., 1989, "Mechanical Property Measurements of Thin Films Using Load-Deflection of Composite Rectangular Membranes," Sensors and Actuators, Vol. 20, pp. 135-141 https://doi.org/10.1016/0250-6874(89)87111-2
  12. Pan, J.Y., Lin, P., Maseeh, F. and Senturia, S.D., 1990, "Verification of FEM Analysis of Load- Deflection Methods for Measuring Mechanical Properties of Thin Films," in Tech. Dig. IEEE Solid- State Sensors and Actuators Workshop, pp. 70-73
  13. Xiang, Y., Chen, X. and Vlassak, J. J., 2005, "Plane-Strain Bulge Test for Thin Films," Journal of Materials Research, Vol. 20, No. 9, pp. 2360-2370 https://doi.org/10.1557/jmr.2005.0313
  14. Ljungcrantz, H., Hultman, L., Sundgren, J. E., Johansson, S., Kristensen, N., Schweitz, J. A. and Shute, C. J., 1993, "Residual Stresses and Fracture Properties of Magnetron Sputtered Ti Films on Si Microelements," J. Vac. Sci. Technol., Vol. 11, No. 3, pp. 543-553 https://doi.org/10.1116/1.578770
  15. Yu Denis Y. W. and Spaepen, F., 2004, "The Yield Strength of Thin Copper Films on Kapton," J. Appl. Phys., Vol. 95, pp. 2991-2997 https://doi.org/10.1063/1.1644634
  16. Hommel, M., Kraft, O. and Arzt, E., 1999, "A New Method to Study Cyclic Deformation of Thin Films in Tension and Compression," Journal of Materials Research, Vol. 14, pp. 2373-2376 https://doi.org/10.1557/JMR.1999.0317
  17. Hommel, M. and Kraft, O., 2001, "Deformation Behavior of Thin Copper Films on Deformable Substrates," Acta Materialia, Vol. 49, pp. 3935-3947 https://doi.org/10.1016/S1359-6454(01)00293-2
  18. Renault, P. O., Villain, P., Coupeau, C., Goudeau, P. and Badawi, K. F., 2003, "Damage Mode Tensile Testing of Thin Gold Films on Polyimide Substrates by X-Ray Diffraction and Atomic Force Microscopy," Thin Solid Films, Vol. 424, pp. 267-273 https://doi.org/10.1016/S0040-6090(02)01127-6
  19. Kraft, O., Hommel, M. and Arzt, E., 2000, "X-Ray Diffraction as a Tool to Study the Mechanical Behaviour of Thin Films," Materials Science and Engineering A, Vol. 288, pp. 209-216 https://doi.org/10.1016/S0921-5093(00)00876-5
  20. Nix, W. D., 1989, "Mechanical Properties of Thin Films," Metall. Trans. A, Vol. 20, pp. 2217-2245 https://doi.org/10.1007/BF02666659
  21. Engler, O. and Huh, M.-Y., 1999, "Evolution of the Cube Texture in High Purity Aluminum Capacitor Foils by Continuous Recrystallization and Subsequent Grain Growth," Materials Science and Engineering A, Vol. 271, pp. 371-381 https://doi.org/10.1016/S0921-5093(99)00254-3
  22. Czerwinski, F., Li, H., Megret, M., Szpunar, J.A., Clark, D.G. and Erb, U., 1997, "The Evolution of Texture and Grain Size During Annealing of Nanocrystalline Ni-45% Fe Electrodeposits," Scripta Materialia, Vol. 37, pp. 1967-1972 https://doi.org/10.1016/S1359-6462(97)00390-4
  23. Hall, E. O., 1957, "The Deformation and Aging of Mild Steel: III. Discussion of Results," Proc. Phys. Soc. Lond. B, Vol. 64, pp. 747-753
  24. Petch, N. J., 1953, "The Cleavage Strength of Polycrystals," J. Iron Steel Inst., Vol. 174, pp. 25-28

Cited by

  1. Evaluating Interfacial Adhesion Properties of Pt/Ti Thin-Film by Using Acousto-Optic Technique vol.36, pp.3, 2016, https://doi.org/10.7779/JKSNT.2016.36.3.188