Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Evaluation of Dicing Characteristics of Diamond Micro-blades with Cu/Sn Binder Including Etched WS2 Particles

표면 부식 처리한 WS2 입자를 첨가한 Cu/Sn계 다이아몬드 마이크로 블레이드의 절삭특성

  • Kim, Song-Hee (Department of Advanced Materials Science and Engineering, Kangwon National University) ;
  • Jang, Jaecheol (Department of Advanced Materials Science and Engineering, Kangwon National University)
  • 김송희 (강원대학교 신소재공학과) ;
  • 장재철 (강원대학교 신소재공학과)
  • Received : 2013.01.31
  • Accepted : 2013.02.21
  • Published : 2013.02.28
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Abstract

$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

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