Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
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Characteristics of the PbO-Bi2O3-B2O3-ZnO-SiO2 Glass System Doped with Pb Metal Filler

Pb 금속필러가 첨가된 PbO-Bi2O3-B2O3-ZnO-SiO2계 유리의 특성

  • Choi, Jinsam (Department of Ceramic Engineering, Gyeongsang National University) ;
  • Jeong, DaeYong (School of Materials Engineering, Inha University) ;
  • Shin, Dong Woo (Department of Ceramic Engineering, Gyeongsang National University) ;
  • Bae, Won Tae (Department of Ceramic Engineering, Gyeongsang National University)
  • 최진삼 (경상대학교 세라믹공학전공) ;
  • 정대용 (인하대학교 신소재공학부) ;
  • 신동우 (경상대학교 세라믹공학전공) ;
  • 배원태 (경상대학교 세라믹공학전공)
  • Received : 2013.02.22
  • Accepted : 2013.05.30
  • Published : 2013.05.31
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Abstract

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

Keywords

References

  1. Y. Imanaka, "Multilayered Low Temperature Cofired Ceramics(LTCC) Technology," pp. 24-26 and 96, Fujitsu Lab., Springer, New York, 2005.
  2. T. Suzuki, "1991 Data Book of Glass Composition(in Japanese)," pp. 141, Glass Manu. Asso. Jp (GMAJ), Tokyo, 1991.
  3. J. S. Choi, "Pb-Free Sealing Materials for Sheath Heater Module(in Japanese)," Jp. Pat. No:2006-201457 (Jul. 25, 2006).
  4. J. S. Choi, D. W. Shin, and W. T. Bae, "Effect of an Additive on the Physical and Electrical Properties of the $B_2O_3-Bi_2O_3$-ZnO Glass System for a Sheath Heater Module(in Korean)," J. Kor. Ceram. Soc., 50 [1] 57-62 (2013). https://doi.org/10.4191/kcers.2013.50.1.57
  5. W. D. Kingery, H. K. Bowen, and D. R. Uhlmann, "Introduction to Ceramics," 2nd Ed., pp.177-181 and 394-95, John Wiley & Sons, New Jersey, 1976.
  6. M. M. Makhlouf, A. M. Mould, and H. D. Merchant, "Sintering of Chemically Preconditioned Tin Powder," Int. J. Powder Metall. Powder Technol., 15 [3] 231-37 (1979).
  7. P. Duwez, R. H. Wikkens, and W. Jr Klement, "Continuous Series of Metastable Solid Solutions in Silver-Copper Alloys," J. Appl. Phys., 31 1136-73 (1960).
  8. J. S. Choi, "Milling Method of Homogeneous Nano Scale Particle for Amorphous Materials with Multi Components System(in Korean)," Kr. Pat. No:10-0933547 (Dec. 15, 2009).
  9. J. S. Choi, "Re-work Paste for Flip Chip Adhesion with Nano Scale Glass Frit(in Korean)," Kr. Pat. No:10-0928044 (Nov. 16, 2006)
  10. J. S. Lee, T. H. Lee, C. W. Huang, and W. P. Pan, "Devitrification Studies of the PbO-ZnO-$B_2O_3$ Glass System with Added $SiO_2$, $BaTiO_3$ and NiO," Thermochim. Acta, 212 13-18 (1992). https://doi.org/10.1016/0040-6031(92)80215-I
  11. V. D. Zivanovic, N. S. Blagojevic, S. R. Grujic, L. C. Karanovic, and B. R. Bozovic, "The Devitrification of $PbOB_2O_3$-ZnO Glass Doped with $Li_2O$," J. Serb. Chem. Soc., 65 [12] 891-98 (2000).
  12. V. K. Nagesh, A. P. Tomsia, and J. A. Pask, "Wetting and Reactions in the Lead Borosilicate Glass-Precious Metal Systems," J. Mater. Sci., 18 [11] 2665-70 (1983). https://doi.org/10.1007/BF00547582
  13. C. E. Hoge, J. J. Brennan, and J. A. Pask, "Inerfacial Reaction and Wetting Behavior of Glass Iron System," J. Am. Ceram. Soc., 56 [2] 51-54 (1973). https://doi.org/10.1111/j.1151-2916.1973.tb12355.x
  14. M. P. Borom and J. A. Pask, "Role of Adherence Oxides in Development of Chemical Bonding at Glass-Metal Interfaces," J. Am. Ceram. Soc., 49 [1] 1-6 (1966).

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