Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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A High-Speed White-Light Scanning Interferometer for Bump Inspection of Semiconductor Manufacture

반도체 Bump 검사를 위한 백색광 주사 간섭계의 고속화

  • Ko, Kuk Won (Department of Information and Communication Engineering, Sunmoon University) ;
  • Sim, Jae Hwan (Department of Information and Communication Engineering, Sunmoon University) ;
  • Kim, Min Young (School of Electronics Engineering, Kyungpook National University)
  • 고국원 (선문대학교 정보통신공학과) ;
  • 심재환 (선문대학교 정보통신공학과) ;
  • 김민영 (경북대학교 전자공학부)
  • Received : 2012.09.17
  • Accepted : 2013.06.14
  • Published : 2013.07.01
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Abstract

The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.

Keywords

References

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