Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Reliability Evaluation Through Moisture Sorption Characterization of Electronic Packaging Materials

전자 패키징 소재의 수착 특성화를 통한 신뢰성 평가

  • Park, Heejin (Corporate R&D Institute, Samsung Electro-Mechanics Co., LTD.)
  • Received : 2013.04.16
  • Accepted : 2013.06.14
  • Published : 2013.09.01
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Abstract

Knowledge of the moisture sorption properties of a material is essential for optimal material development and analysis of the delamination failure caused by vapor pressure at the interlayer during the manufacturing process of integrated packaging devices. In this paper, both temperature dependent absorption and desorption properties according to temperature and humidity model are parameterized and the effects of water activities and temperature are discussed. The activation energy obtained from the parameterized diffusivity determines the acceleration factor for the equivalency of moisture sorption levels, which enables the effect of moisture diffusivity on the equivalent elapsed testing time required for evaluating the reliable life time to be estimated. The acceleration factor evaluated at the reliability testing standard of the flexible packaging module is exampled.

습기 수착 물성은 전자 패키징 장치의 신뢰성에 있어서 층간의 수증기 압력에 의해 공정과정 동안 발생되는 박리 불량의 고장 분석 및 최적의 재료 개발에 있어서 필수적이다. 본 논문에서는 온습도 모델에 따른 전자 패키징 재료의 온도 의존적인 흡습 및 탈습 물성을 변수화 하였고 이에 대한 온도 및 습도의 영향에 대해 고찰하였다. 변수화된 확산성에서 얻어진 확산 활성화 에너지는 등가의 습기 수착 수준을 위한 가속 수명 비율을 결정하고 신뢰 수명 평가에 요구되는 등가의 소요 시험 시간에 미치는 습기 확산성의 영향을 예측할 수 있게 한다. 신뢰성 시험 표준에서 평가된 유연 전자 모듈의 가속 수명비율을 예시하였다.

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References

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