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Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability

무전해 Ni-P 두께와 Assembly Process가 Solder Ball Joint의 신뢰성에 미치는 영향

  • Received : 2014.04.09
  • Accepted : 2014.05.12
  • Published : 2014.06.30

Abstract

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

Keywords

References

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  1. Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 1. Effects of thickness and roughness of electroless Ni-P deposit vol.21, pp.3, 2014, https://doi.org/10.6117/kmeps.2014.21.3.043