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Effect of Bonding Temperature and Bonding Pressure on Deformation and Tensile Properties of Diffusion Bonded Joint of STS304 Compact Heat Exchanger

STS304 콤팩트 열교환기 고상확산접합부의 접합부 변형과 인장성질에 미치는 접합온도 및 접합압력의 영향

  • Jeon, Ae-Jeong (National Core Research Center(NCRC), Pusan National University) ;
  • Yoon, Tae-Jin (National Core Research Center(NCRC), Pusan National University) ;
  • Kim, Sang-Ho (Dept. of Material Science and Engineering, Pusan National University) ;
  • Kim, Hyeon-Jun (DongHwa Entec Co., Ltd. R&D Center) ;
  • Kang, Chung-Yun (Dept. of Material Science and Engineering, Pusan National University)
  • 전애정 (부산대학교 하이브리드소재솔루션 국가핵심연구센터) ;
  • 윤태진 (부산대학교 하이브리드소재솔루션 국가핵심연구센터) ;
  • 김상호 (부산대학교 재료공학부) ;
  • 김현준 ((주)동화엔텍 에너지 환경기술연구소) ;
  • 강정윤 (부산대학교 재료공학부)
  • Received : 2014.06.12
  • Accepted : 2014.08.12
  • Published : 2014.08.31

Abstract

In this study, the effect of bonding temperature and bonding pressure on deformation and tensile properties of diffusion bonded joint of STS304 compact heat exchanger was investigated. The diffusion bonds were prepared at 700, 800 and $900^{\circ}C$ for 30, 60 and 90 min in pressure of 3, 5, and 7 MPa under high vacuum condition. The height deformation of joint decreased and the width deformation of joint increased with increasing bonding pressure at $900^{\circ}C$. The ratio of non-bonded layer and void observed in the joint decreased with increasing bonding temperature and bonding pressure. Three types of the fracture surface were observed after tensile test. The non-bonded layer was observed in diffusion bonded joint preformed at $700^{\circ}C$, the non-bonded layer and void were observed at $800^{\circ}C$. On the other hand, the ductile fracture occurred in diffusion bonded joint preformed at $900^{\circ}C$. Tensile load of joint bonded at $800^{\circ}C$ was proportional to length of bonded layer and tensile load of joint bonded at $900^{\circ}C$ was proportional to minimum width of pattern. The tensile strength of joint was same as base metal.

Keywords

References

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