Journal of Korean Society of Occupational and Environmental Hygiene (한국산업보건학회지)

Korean Industrial Hygiene Association (한국산업보건학회)
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Exposure Characteristics for Chemical Substances and Work Environmental Management in the Semiconductor Assembly Process

반도체 조립공정의 화학물질 노출특성 및 작업환경관리

  • Park, Seung-Hyun (Occupational Safety and Health Research Institute, Korea Occupational Safety and Health Agency) ;
  • Park, Hae Dong (Occupational Safety and Health Research Institute, Korea Occupational Safety and Health Agency) ;
  • Shin, In Jae (Seoul Regional Employment and Labor Office, Ministry of Employment and Labor)
  • 박승현 (한국산업안전보건공단 산업안전보건연구원) ;
  • 박해동 (한국산업안전보건공단 산업안전보건연구원) ;
  • 신인재 (고용노동부 서울지방고용노동청)
  • Received : 2014.06.17
  • Accepted : 2014.09.22
  • Published : 2014.09.30
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Abstract

Objectives: The purpose of this study was to evaluate the characteristics of worker exposure to hazardous chemical substances and propose the direction of work environment management for protecting worker's health in the semiconductor assembly process. Methods: Four assembly lines at two semiconductor manufacturing companies were selected for this study. We investigated the types of chemicals that were used and generated during the assembly process, and evaluated the workers' exposure levels to hazardous chemicals such as benzene and formaldehyde and the current work environment management in the semiconductor assembly process. Results: Most of the chemicals used at the assembly process are complex mixtures with high molecular weight such as adhesives and epoxy molding compounds(EMCs). These complex mixtures are stable when they are used at room temperature. However workers can be exposed to volatile organic compounds(VOCs) such as benzene and formaldehyde when they are used at high temperature over $100^{\circ}C$. The concentration levels of benzene and formaldehyde in chip molding process were higher than other processes. The reason was that by-products were generated during the mold process due to thermal decomposition of EMC and machine cleaner at the process temperature($180^{\circ}C$). Conclusions: Most of the employees working at semiconductor assembly process are exposed directly or indirectly to various chemicals. Although the concentration levels are very lower than occupational exposure limits, workers can be exposed to carcinogens such as benzene and formaldehyde. Therefore, workers employed in the semiconductor assembly process should be informed of these exposure characteristics.

Keywords

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