DOI QR코드

DOI QR Code

Comparative Study of Global Warming Effects during Silicon Nitride Etching Using C3F6O/O2 and C3F6/O2 Gas Mixtures

  • Kim, Ka Youn (Department of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Moon, Hock Key (Department of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Lee, Nae-Eung (Department of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Hong, Bo Han (WONIK IPS Ltd.) ;
  • Oh, Soo Ho (WONIK IPS Ltd.)
  • 투고 : 2014.03.11
  • 심사 : 2014.06.09
  • 발행 : 2015.01.20

초록

$C_3F_6$ and $C_3F_6O$ gases were investigated as replacement gases for $SF_6$ used in display industry due to their low global warming potential and short lifetime. In the $C_3F_6/O_2$ and $C_3F_6O/O_2$ capacitively coupled plasmas, $Si_3N_4$ etch conditions were varied by controlling process parameters. The global warming effects were quantified as million metric ton carbon equivalents (MMTCEs) obtained from the volumetric emission of by-product and etch gases. A lower MMTCE value and higher etch rate process with combination of high and low source frequencies, $f_{HF}$ (27.12 MHz)/$f_{LF}$ (2 MHz), were observed for the $C_3F_6O/O_2$ chemistry than for the $C_3F_6/O_2$ chemistry.

키워드

과제정보

연구 과제번호 : Development of fundamental technology for 10 nm process semiconductor and 10 G size large area process with high plasma density and VHF condition

연구 과제 주관 기관 : Ministry of Trade, Industry and Energy (MOTIE, Republic of Korea)

참고문헌

  1. J. Y. Hwang, D. J. Kim, N.-E. Lee, Y. C. Jang, and G. H. Bae, J. Vac. Sci. Technol. 24, 1380 (2006). https://doi.org/10.1116/1.2206190
  2. Y. W. Xiewen and T. P. Ma, IEEE Trans Electron Devices 46, 362 (1998).
  3. A. D. Johnson, R. G. Ridgeway, and P. J. Maroulis, IEEE Transactions on Semiconductor Manufacturing 17, 491 (2004). https://doi.org/10.1109/TSM.2004.835700
  4. D. Cho, S. Woo, J. Yang, D. Lee, Y. Lim, D. Kim, S. Park, and M. Yi, Electron. Mater. Lett. 9, 381 (2013). https://doi.org/10.1007/s13391-013-0005-5
  5. J.-D. Kwon, Electron. Mater. Lett. 9, 875 (2013). https://doi.org/10.1007/s13391-013-6033-3
  6. D. J. Kim, Y. B. Yun, J. Y. Hwang, N.-E. Lee, K. S. Kim, and G. H. Bae, Microelectron. Eng. 84, 560 (2007). https://doi.org/10.1016/j.mee.2006.11.007
  7. S. H. Han, H. W. Park, T. H. Kim, and D. W. Park, Clean Tech. 17, 250 (2011).
  8. I. J. Kim, H. K. Moon, J. H. Lee, N.-E. Lee, J. W. Jung, and S. H. Cho, Microelectron. Reliab. 52, 2970 (2012). https://doi.org/10.1016/j.microrel.2012.07.013
  9. H. J. Francis, H. J. Peter, and Z. Zbiqniew, US Patent 6, 682, 585 (2004).
  10. R. Chatterjee, S. Karecki, L. Pruette, and R. Reif, Proc. Electrochem. Soc. 99, 251 (1999).
  11. J. T. Houghton, Climate Change 1994. (Press Syndicate of the University of Cambridge, 1995).
  12. D. H. Kim, C. H. Lee, S. H. Cho, N.-E. Lee, and G. C. Kwon, J. Vac. Sci. Technol. B23, 2203 (2005).
  13. D. H. Kim, S. H. Cho, N.-E. Lee, and K. C. Kwon, Jpn. J. Appl. Phys. 44, 5856 (2005). https://doi.org/10.1143/JJAP.44.5856
  14. B. S. Kwon, J. S. Kim, N.-E. Lee, and J. W. Shon, J. Electrochem. Soc. 157, D135 (2010). https://doi.org/10.1149/1.3275710
  15. K. J. Kim, C. H. Oh, N.-E. Lee, J. H. Kim, J. W. Bee, G. Y. Yeom, and S. S. Yoon, J. Vac. Sci. Technol. 22, 483 (2004). https://doi.org/10.1116/1.1645881
  16. S. A. Rosli, A. A. Aziz, and H. A. Hamid, IEEE International Conf. Semiconductor Electronics, 851 (2006).
  17. H. F. Winters, J. Appl. Phys. 49, 5165 (1978). https://doi.org/10.1063/1.324411
  18. M. A. Gilliam, Q. Yu, and H. Yasuda, Plasma Proc. Polymers 4, 165 (2007). https://doi.org/10.1002/ppap.200600076
  19. F. Fracassi, R. D'Agostino, A. Fornelli, and T. Shirafuji, Jpn. J. Appl. Phys. 41, 6287 (2002). https://doi.org/10.1143/JJAP.41.6287

피인용 문헌

  1. Investigation of dielectric properties of cold C3F8 mixtures and hot C3F8 gas as Substitutes for SF6 vol.69, pp.10, 2015, https://doi.org/10.1140/epjd/e2015-60327-9
  2. Improvement of minority carrier life time in N-type monocrystalline Si by the Czochralski method vol.12, pp.4, 2015, https://doi.org/10.1007/s13391-016-4001-4
  3. Effects of micro-water on decomposition of the environment-friendly insulating medium C5F10O vol.7, pp.6, 2017, https://doi.org/10.1063/1.4990512
  4. Electron impact ionization of perfluoro-methyl-vinyl-ether C3F6O vol.27, pp.1, 2018, https://doi.org/10.1088/1361-6595/aaa22e
  5. SiO2 etch characteristics and environmental impact of Ar/C3F6O chemistry vol.36, pp.6, 2015, https://doi.org/10.1116/1.5027446
  6. Low energy elastic scattering of electrons from hexafluoropropene (C3F6) vol.52, pp.2, 2015, https://doi.org/10.1088/1361-6455/aaf021
  7. Low-global warming potential fluoroether compounds for plasma etching of SiO2 and Si3N4 layers vol.37, pp.5, 2015, https://doi.org/10.1116/1.5100302
  8. Adsorption and Recovery using Vaporization of Liquid Fluorocarbon Precursor vol.58, pp.6, 2015, https://doi.org/10.3365/kjmm.2020.58.6.397