Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Study of Standardization and Test Certification for Wearable Smart Devices

웨어러블 스마트기기의 표준화 및 시험인증 연구

  • Han, Tae-Su (Korean Agency for Technology and Standards) ;
  • Kim, Deok-kee (Department of Electrical Engineering, Sejong University) ;
  • Kwon, Oh-Young (Department of Manufacturing System and Design Engineering, Seoul National University of Science and Technology) ;
  • Choa, Sung-Hoon (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
  • 한태수 (국가기술표준원) ;
  • 김덕기 (세종대학교) ;
  • 권오영 (서울과학기술대학교 일반대학원) ;
  • 좌성훈 (서울과학기술대학교 나노IT디자인융합 대학원)
  • Received : 2016.12.10
  • Accepted : 2016.12.16
  • Published : 2016.12.31
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Abstract

Today, wearable technology products are used in a wide range of consumer, healthcare, bio-medical, and industrial applications. The market for wearable technology products is expected to increase dramatically over the next several years. In addition, concerns for safety, performance and reliability of wearable products keep increasing and will be essential for widespread acceptance in the marketplace. Wearable smart devices, which are generally in contact with the human body and skin, are exposed to the risk of the electric shock, burn, and explosion. Therefore, the standardization of wearable devices in terms of human safety and reliability should be very important. Furthermore, the development of test method and test certification of the wearable products will be one of the key technology for mass production. Such standardization and certification will help consumers to choose the safest and best quality wearable devices and allow manufacturers to prove the safety and quality of their products, thereby helping them to gain a competitive technology. This paper discusses the current status of the wearable smart devices as well as the standardization and test certification applicable to wearable technology products.

Keywords

References

  1. J. Y. Choi, D. W. Park and T. S. Oh, "Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications", J. Microelectron. Packag. Soc., 21(4), 125 (2014). https://doi.org/10.6117/kmeps.2014.21.4.125
  2. J. Y. Choi, D. H. Park and T. S. Oh, "Chip Interconnection Process for Smart Fabrics Using Flip-chip Bonding of SnBi Solder", J. Microelectron. Packag. Soc., 19(3), 71 (2012). https://doi.org/10.6117/KMEPS.2012.19.3.071
  3. S. H. Choa, T. S. Han and W. J. Kim, "Recent Trend of International Standardization of Semiconductor Devices", J. Microelectron. Packag. Soc., 23(1), 1 (2016). https://doi.org/10.6117/KMEPS.2016.23.1.001
  4. J. H. Chang, J. J. Park and J. M. Kim, "Recent Trend of Smart Device Technology and Test Certification", The Magazine of Institute of Electronics Enginners of Korea, 41(8), 38 (2016).
  5. R. D. Pietro and L. V. Mancini, "Security and Privacy Issues of Handheld and Wearable Wireless Devices", Commun. ACM., 46(9), 74 (2003). https://doi.org/10.1145/903893.903897
  6. M. Syduzzaman, S. U. Patwary, K. Farhana and S. Ahmed, "Smart Textiles and Nano-Technology: A General Overview", J. Textile. Sci. Eng., 5(1), 1000181 (2015).
  7. Z. Zhu, T. Liu, G. Li, T. Li and Y. Inoue, "Wearable Sensor Systems for Infants", Sensors, 15(2), 3721 (2015). https://doi.org/10.3390/s150203721
  8. J. H. M. Bergmann, V. Chandaria and A. McGregor, "Wearable and Implantable Sensors: The Patient's Perspective", Sensors, 12(12), 16695 (2012). https://doi.org/10.3390/s121216695